VACUUM DIFFUSION BONDING, also known as VDDBOND, is an advanced connection technology widely used in microelectronics, nanoelectronics, optoelectronics, biomedicine and other fields. This technology creates atomic-level connections between two or more materials to achieve excellent electrical properties and mechanical stability.

The basic principle of VACUUM DIFFUSION BONDING is to perform high-temperature heat treatment in a vacuum to diffuse and rearrange atoms on the surface of the material to achieve connection. This method eliminates residual stress between interfaces and results in a flat, defect-free interface. By controlling the time and temperature of the heat treatment, the mechanical and electrical properties of the connection can be optimized.

The advantage of this technology is its high accuracy and reliability. Since it is performed in a vacuum, it prevents oxidation and contamination, thereby increasing the stability and durability of the connection. VACUUM DIFFUSION BONDING can form large area connections, which makes it ideal for mass production.

In the biomedical field, VACUUM DIFFUSION BONDING is used to manufacture high-precision biosensors and bioelectronic devices. These devices need to operate within the human body and therefore need to be highly stable and durable. By using VACUUM DIFFUSION BONDING, the interfaces of these devices can be ensured with atomic-level precision while providing excellent electrical performance and mechanical stability.