Vacuum brazing is a processing technique that uses solder to join two or more metal or ceramic materials together in a vacuum environment. It has the following advantages:
1. High-strength connection: Vacuum brazing technology can chemically react the brazing material with the surface of the material at high temperature to form a dense brazing joint. This connection has high strength and corrosion resistance, and can withstand large forces and temperature changes.
2. Low temperature processing: Compared with traditional welding methods, vacuum brazing is usually performed at lower temperatures. This helps to avoid thermal deformation and tissue degradation of the material, and is especially suitable for the processing of high-temperature, easily oxidized or heat-sensitive materials.
3. Ensure material purity: In a vacuum environment, the influence of atmospheric pollution on materials can be effectively reduced, thereby ensuring the high purity of the connection. This is especially important for applications that require high-purity materials, such as semiconductor devices, fiber optic communications, etc.
4. No need for additional filler material: Vacuum brazing usually does not require additional filler material, and only brazing filler metal is required to achieve the connection. This not only simplifies the processing technology and reduces the material cost, but also avoids the negative impact of the filler on the connection performance.
5. Various materials can be brazed: vacuum brazing technology is suitable for the connection of various metals and ceramic materials, including materials with different melting points and chemical properties. This provides more options for the preparation of composite materials, multifunctional materials and advanced materials.
In general, vacuum brazing technology has the advantages of high-strength connection, low-temperature processing, maintaining material purity, no need for additional filler materials, and being applicable to a variety of materials. This makes it an important method for the fabrication of many high-performance devices and the processing of special materials.